GIGABYTE B660M AORUS PRO DDR4 Mainboard

1. Support for DDR4 3200/3000/2933/2666/2400/2133 MHz memory modules
2. 4 x DDR DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory
3. Dual channel memory architecture
4. Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
5. Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
6. Support for Extreme Memory Profile (XMP) memory modules

(Please refer “Memory Support List” for more information.)

1. 1 x HDMI port, supporting a maximum resolution of 4096×2160@60 Hz
   * Support for HDMI 2.1 version and HDCP 2.3.
   ** Support native HDMI 2.1 TMDS compatible ports
2. 1 x DisplayPort, supporting a maximum resolution of 4096×2304@60 Hz
   * Support for DisplayPort 1.2 version and HDCP 2.3

(Graphics specifications may vary depending on CPU support.)

1. Support for AMD Quad-GPU CrossFire™ and 2-Way AMD CrossFire™ technologies

1. 1 x PCI Express x16 slot, running at x16 (PCIEX16)
   * For optimum performance, if only one PCI Express graphics card is to be installed, be sure to install it in the PCIEX16 slot.
   (The PCIEX16 slot conforms to PCI Express 4.0 standard.)
2. 1 x PCI Express x16 slot, running at x4 (PCIEX4)

(The PCIEX4 slot conforms to PCI Express 3.0 standard.)

1. 1 x M.2 connector (Socket 3, M key, type 2260/2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU)

Chipset:

1. 1 x M.2 connector (Socket 3, M key, type 2260/2280/22110 PCIe 4.0 x4/x2 SSD support) (M2P_SB)
2. 4 x SATA 6Gb/s connectors

Support for SATA RAID 0, RAID 1, RAID 5, and RAID 10
Intel^® Optane™ Memory Ready
* System acceleration with Intel^® Optane™ Memory can only be enabled on the M.2 connector supported by the Chipset.

1. Intel^®2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps)

1. Realtek^® Audio CODEC
2. High Definition Audio
3. 2/4/5.1/7.1-channel
   * To configure 7.1-channel audio, you need to open the audio software and select Device advanced settings > Playback Device to change the default setting first. Please visit GIGABYTE’s website for details on configuring the audio software.
4. Support for S/PDIF Out

1. 1 x USB Type-C^® port, with USB 3.2 Gen 2×2 support
2. 1 x USB 3.2 Gen 2 Type-A port (red)
3. 4 x USB 3.2 Gen 1 ports
4. 4 x USB 2.0/1.1 ports
5. 1 x HDMI port
6. 1 x DisplayPort
7. 1 x RJ-45 port
8. 1 x optical S/PDIF Out connector
9. 2 x audio jacks

1. 1 x 24-pin ATX main power connector
2. 1 x 8-pin ATX 12V power connector
3. 1 x 4-pin ATX 12V power connector
4. 1 x CPU fan header
5. 1 x water cooling CPU fan header
6. 3 x system fan headers
7. 1 x system fan/water cooling pump header
8. 2 x addressable LED strip headers
9. 2 x RGB LED strip headers
10. 2 x M.2 Socket 3 connectors
11. 4 x SATA 6Gb/s connectors
12. 1 x front panel header
13. 1 x front panel audio header
14. 1 x USB Type-C^® header, with USB 3.2 Gen 2 support
15. 1 x USB 3.2 Gen 1 header
16. 2 x USB 2.0/1.1 headers
17. 2 x Thunderbolt™ add-in card connectors
18. 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only)
19. 1 x serial port header
20. 1 x reset button
21. 1 x Q-Flash Plus button
22. 1 x reset jumper
23. 1 x Clear CMOS jumper